stimesi

TRONICS Microsystems: MEMSOI process

In 1999, TRONICS Microsystems, a reliable provider of custom MEMS components, established MEMSOI, the first Multi-Project Wafer service for MEMS on SOI offered through Europractice. Mid-2006, TRONICS Microsystems upgraded its technology by proposing the first 60µm thick SOI MEMS MPW service featuring a hermetic wafer level packaging.

MEMS sensor
Hermetically sealed Wafer Level packaged MEMS sensor
built on TRONICS’ MEMSOI service

 

The MEMSOI MPW prototyping service now features:

  1. DRIE High aspect ratio micromachining
  2. 60µm structural layer
  3. Wafer level packaging with hermetic sealing
  4. Openings for fluids, light of vacuum.

 

memsoi mpw 

 

Customers benefit from the excellent mechanical properties of the 60µm thick silicon layer to build and prototype highly sensitive capacitive transducers, electrostatic and thermal actuators, resonators and microfluidics test structures.

Once their concept prototyped on the MEMSOI service, customers benefit from TRONICS professional development and industrialization services including technology customization, packaging (e.g. high vacuum packaging) and electronic interface developments in order to create custom components for your most demanding applications.

gyro structure
Gyro structure built on MEMSOI

TRONICS Microsystems’ MEMSOI technology and service is described on a design rules handbook and is supported by a dedicated software design kit that is built on Coventorware the world leading MEMS design tools suite.

For more information please consult www.tronics-mst.com/memsoi.html